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Certifications
BOM Tool

XC1701LPDG8C

Part No XC1701LPDG8C
Manufacturer
Catalog Memory - Configuration Proms for FPGAs
PDF
rohs

Shipping Information

Shipped from HK warehouse
Expected Shipping Date Ask for an estimation
Supplier Lead-Time Call for availability

Products specifications

Physical

Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8

Technical

Operating Temperature 0°C~70°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC1701L
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1Mb
Operating Mode SYNCHRONOUS
Clock Frequency 15MHz
Supply Current-Max 0.01mA
Organization 1MX1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY

Dimensions

Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm

Compliance

RoHS Status RoHS Compliant

Description

XC1701L Matte Tin (Sn) e3 Tube ics fpga configuration 7.62mm 0.01mA 1Mb 3.3V

Contact Us

10,000+

Daily Order Quantity

5000,000+

Alternative Parts

2800+

Worldwide Manufacturers

32,000m²

In-stock Warehouse

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