Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2016
Series Zynq?-7000
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 485
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B485
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Number of I/O 150
Speed 667MHz
RAM Size 256KB
Core Processor Single ARM? Cortex?-A9 MPCore? with CoreSight?
Peripherals DMA
Clock Frequency 667MHz
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix?-7 FPGA, 55K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB