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Certifications
BOM Tool

XCZU9CG-1FFVC900E

Part No XCZU9CG-1FFVC900E
Manufacturer
Catalog Embedded - System On Chip (SoC)
PDF
rohs

Shipping Information

Shipped from HK warehouse
Expected Shipping Date Ask for an estimation
Supplier Lead-Time Call for availability

Products specifications

Supply Chain

Factory Lead Time 11 Weeks

Physical

Package / Case 900-BBGA, FCBGA

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq? UltraScale+? MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 599K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

Description

IC SOC CORTEX-A53 900FCBGA

Contact Us

10,000+

Daily Order Quantity

5000,000+

Alternative Parts

2800+

Worldwide Manufacturers

32,000m²

In-stock Warehouse

Item added to your cart.