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Certifications
BOM Tool

XCZU4CG-1FBVB900E

Part No XCZU4CG-1FBVB900E
Manufacturer
Catalog Embedded - System On Chip (SoC)
PDF
rohs

Shipping Information

Shipped from HK warehouse
Expected Shipping Date Ask for an estimation
Supplier Lead-Time Call for availability
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1+
$1034.6486
$1034.649
10+
$1000.627269
$10006.273
25+
$993.671581
$24841.79
50+
$986.764226
$49338.211
100+
$966.468383
$96646.838
500+
$897.37084
$448685.42
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.
Availability: In Stock pieces
MOQ: 1 pcs
Order Increment : 1 pcs
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Products specifications

Supply Chain

Factory Lead Time 11 Weeks

Technical

Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq? UltraScale+? MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq?UltraScale+? FPGA, 192K+ Logic Cells

Compliance

RoHS Status ROHS3 Compliant

Physical

Package / Case 900-BBGA, FCBGA

Description

FPGA Zynq UltraScale+ Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray

Contact Us

10,000+

Daily Order Quantity

5000,000+

Alternative Parts

2800+

Worldwide Manufacturers

32,000m²

In-stock Warehouse

Item added to your cart.