Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series i.MX6Q
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 624
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B624
Supply Voltage-Max (Vsup) 1.5V
Supply Voltage-Min (Vsup) 1.275V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM? Cortex?-A9
Clock Frequency 24MHz
Bit Size 64
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (4)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON? SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 3Gbps (1)